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High reactivity with standard amine and anhydride curing agents for rapid gelation and short cycle times.
Excellent adhesion to metals, composites, and treated plastics without surface priming.
Low viscosity (8,000–12,000 cP at 25°C) enabling easy processing via casting, impregnation, and resin transfer molding.
Superior electrical insulation properties with high dielectric strength and volume resistivity.
Good thermal stability with glass transition temperature (Tg) of approximately 125–135°C after full cure.
Electrical encapsulation of transformers, reactors, and high-voltage insulators.
Structural adhesive formulations for aerospace composite bonding and automotive metal-to-composite joints.
Matrix resin for fiber-reinforced laminates in wind turbine blade root sections and marine components.
Casting and potting compounds for industrial sensors, power electronics modules, and LED lighting housings.
Prepreg impregnation in high-performance printed circuit board (PCB) base materials and multilayer substrates.
| Chemical Type | Diglycidyl ether of bisphenol-A (DGEBA) |
| Product Form | Liquid resin |
| Appearance | Pale yellow to amber transparent liquid |
| Epoxy Equivalent Weight (EEW) | 185–195 g/eq |
| Viscosity (25°C) | 8,000–12,000 cP |
| Chloride Content | ≤ 700 ppm |
| Volatiles Content | ≤ 0.3 wt% |
| Storage Stability | Stable for ≥ 12 months at 25°C in sealed containers |
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E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
