High reactivity with amine and anhydride hardeners for rapid cure at ambient or elevated temperatures.
Excellent adhesion to metals, composites, and various substrates without extensive surface preparation.
Low viscosity (12,000–14,000 cP at 25°C) enabling easy processing, impregnation, and flow control in casting and laminating.
Superior electrical insulation properties with high dielectric strength and volume resistivity.
Good chemical resistance to alkalis, dilute acids, and common solvents after full cure.
Electrical encapsulation and potting of transformers, reactors, and high-voltage insulators.
Structural adhesive formulations for aerospace and automotive composite bonding.
Matrix resin for fiber-reinforced polymer (FRP) laminates and pultruded profiles.
Casting and molding of precision industrial components requiring dimensional stability.
Coating systems for corrosion protection of steel infrastructure and marine equipment.
| Chemical Type | Bisphenol-A based liquid epoxy resin |
| Product Form | Clear to pale yellow viscous liquid |
| Appearance | Homogeneous, transparent, free from gel particles and sediment |
| Epoxy Equivalent Weight (EEW) | 185–195 g/eq |
| Viscosity (25°C) | 12,000–14,000 cP |
| Chloride Content | ≤ 500 ppm |
| Softening Point | Not applicable (liquid at room temperature) |
| Primary Applications | Encapsulation, structural adhesives, FRP matrix, protective coatings |
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E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China