High purity bisphenol-A based liquid epoxy resin with low chlorine content.
Excellent thermal stability and consistent reactivity for reliable curing performance.
Low viscosity enables easy handling, mixing, and impregnation in demanding processes.
Superior electrical insulation properties suitable for high-voltage applications.
Compatible with standard amine and anhydride hardeners for flexible formulation design.
Electrical encapsulation and potting compounds for transformers and sensors.
High-performance laminates in printed circuit board (PCB) substrates.
Structural adhesives requiring thermal resistance and dimensional stability.
Composite matrix resin for aerospace and wind turbine blade components.
Coatings and linings for corrosion-resistant industrial equipment.
| Chemical Type | Bisphenol-A Epoxy Resin |
| Product Form | Clear to pale yellow liquid |
| Appearance | Transparent, homogeneous liquid |
| Epoxy Equivalent Weight (EEW) | 185–192 g/eq |
| Viscosity (25°C) | 12,000–15,000 cP |
| Chlorine Content | ≤ 800 ppm |
| Softening Point | Not applicable (liquid at room temperature) |
| Primary Applications | Electrical insulation, composites, adhesives, coatings |
Q1: What is the primary functional role of KD-2103 in epoxy formulations?
A: KD-2103 is a reactive liquid diluent designed to reduce viscosity and improve processability of standard bisphenol-A or bisphenol-F based epoxy resins without significantly compromising crosslink density or thermal performance.
Q2: Is KD-2103 suitable for high-gloss, low-VOC coating systems?
A: Yes — as a reactive diluent, KD-2103 participates in the curing reaction and does not volatilize, supporting VOC compliance in industrial coatings, adhesives, and composite laminating resins where solvent reduction is required.
Q3: How does KD-2103 compare to non-reactive diluents in terms of final film properties?
A: Unlike non-reactive plasticizers or solvents, KD-2103 becomes part of the polymer network upon cure, helping retain mechanical strength, chemical resistance, and glass transition temperature — particularly when used at moderate incorporation levels.
Q4: Can KD-2103 be used with both amine and anhydride curing agents?
A: Yes — KD-2103 is compatible with common aliphatic and aromatic amines, as well as cyclic anhydrides, and typically requires no special adjustment to standard stoichiometric ratios or cure schedules.
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