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High purity bisphenol-A based liquid epoxy resin with low chlorine content.
Excellent thermal stability and consistent reactivity for reliable curing performance.
Low viscosity enables easy handling, mixing, and impregnation in demanding processes.
Superior electrical insulation properties suitable for high-voltage applications.
Compatible with standard amine and anhydride hardeners for flexible formulation design.
Electrical encapsulation and potting compounds for transformers and sensors.
High-performance laminates in printed circuit board (PCB) substrates.
Structural adhesives requiring thermal resistance and dimensional stability.
Composite matrix resin for aerospace and wind turbine blade components.
Coatings and linings for corrosion-resistant industrial equipment.
| Chemical Type | Bisphenol-A Epoxy Resin |
| Product Form | Clear to pale yellow liquid |
| Appearance | Transparent, homogeneous liquid |
| Epoxy Equivalent Weight (EEW) | 185–192 g/eq |
| Viscosity (25°C) | 12,000–15,000 cP |
| Chlorine Content | ≤ 800 ppm |
| Softening Point | Not applicable (liquid at room temperature) |
| Primary Applications | Electrical insulation, composites, adhesives, coatings |
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E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
