High reactivity with standard amine and anhydride curing agents for rapid gelation and short cycle times.
Excellent adhesion to metals, composites, and treated plastics without requiring primers.
Low viscosity (8,000–12,000 cP at 25°C) enabling easy processing, impregnation, and air release.
Superior thermal stability with glass transition temperature (Tg) up to 130°C after full cure.
Low chloride content (< 500 ppm), ensuring compatibility with sensitive electronic and aerospace components.
Structural adhesive formulations for automotive bonding and lightweight assembly.
Matrix resin for fiber-reinforced composites in wind turbine blades and sporting goods.
Encapsulation and potting compounds for power electronics and LED modules.
Electrical insulating varnishes for motor and transformer coil impregnation.
High-performance coating systems for corrosion-resistant industrial flooring and tank linings.
| Chemical Type | Bisphenol-A based liquid epoxy resin |
| Product Form | Clear, low-viscosity amber liquid |
| Appearance | Transparent to slightly yellow, homogeneous liquid |
| Epoxy Equivalent Weight (EEW) | 475–495 g/eq |
| Viscosity (25°C) | 8,000–12,000 cP |
| Chlorine Content | < 500 ppm |
| Softening Point | Not applicable (liquid at room temperature) |
| Storage Stability | 12 months at 20–25°C in sealed containers |
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E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China