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High reactivity with standard amine and anhydride curing agents for rapid gelation and short cycle times.
Excellent adhesion to metals, composites, and cured concrete substrates.
Low viscosity (1,800–2,200 cP at 25°C) enabling easy processing, impregnation, and air release.
Superior chemical resistance to alkalis, solvents, and diluted acids after full cure.
Good thermal stability with glass transition temperature (Tg) of 120–125°C post-cure.
Structural adhesives for automotive and aerospace bonding.
Electrical encapsulation and potting compounds for power electronics.
High-performance composite matrix resin for wind turbine blades and sporting goods.
Repair mortars and polymer-modified grouts in civil engineering.
Coating systems for corrosion protection of steel infrastructure.
| Chemical Type | Bisphenol-A based liquid epoxy resin |
| Product Form | Clear to pale yellow viscous liquid |
| Appearance | Homogeneous, transparent, free from gels or sediment |
| Epoxy Equivalent Weight (EEW) | 185–192 g/eq |
| Viscosity (25°C) | 1,800–2,200 mPa·s |
| Chlorine Content | ≤ 700 ppm |
| Volatiles Content | ≤ 0.3 wt% |
| Storage Stability | 12 months at ≤ 25°C in unopened original packaging |
Q1: What is the primary functional role of KD-293 in epoxy formulations?
A: KD-293 is a reactive diluent designed to reduce viscosity and improve processability of standard bisphenol-A or bisphenol-F based epoxy resins without significantly compromising crosslink density or thermal performance.
Q2: Is KD-293 suitable for high-gloss, low-VOC coating systems?
A: Yes — as a mono-functional reactive diluent with low volatility and minimal odor, KD-293 supports VOC reduction and enhances flow/leveling in decorative and protective coatings where low emissions and surface aesthetics are critical.
Q3: How does KD-293 affect cure kinetics and final mechanical properties?
A: It extends pot life moderately while maintaining acceptable gel time under standard amine curing conditions; final cured films retain good flexibility and adhesion, though hardness and chemical resistance may be slightly reduced versus non-diluted systems depending on loading level.
Q4: Can KD-293 be used in electronic encapsulation or potting applications?
A: It is occasionally employed in less demanding encapsulation systems where lower viscosity and improved filler wetting are needed, but it is not recommended for high-reliability electronics due to its mono-functional nature and potential impact on long-term Tg stability and moisture resistance.
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