High reactivity with standard amine and anhydride curing agents for rapid gelation and short cycle times.
Excellent adhesion to metals, composites, and treated plastics without primer requirement.
Low viscosity (12,000–15,000 cP at 25°C) enabling easy processing, impregnation, and air bubble release.
Good thermal stability with glass transition temperature (Tg) up to 135°C after full cure.
Low chloride content (< 800 ppm), ensuring high electrical insulation performance and corrosion resistance.
Electrical encapsulation of transformers, reactors, and high-voltage insulators.
Structural adhesive formulation for aerospace composite bonding and automotive lightweight assemblies.
Matrix resin for filament-wound pressure vessels and fiber-reinforced polymer (FRP) tanks.
Coating and lining systems for chemical-resistant industrial flooring and tank interiors.
Prepreg and infusion resins in wind turbine blade manufacturing.
| Chemical Type | Bisphenol-A based liquid epoxy resin |
| Product Form | Clear to pale yellow viscous liquid |
| Appearance | Homogeneous, transparent, free from gels or suspended particles |
| Epoxy Equivalent Weight (EEW) | 184–190 g/eq |
| Viscosity (25°C) | 12,000–15,000 cP |
| Chlorine Content | ≤ 800 ppm |
| Volatiles Content | ≤ 0.3 wt% |
| Storage Stability | 12 months at ≤ 25°C in unopened original packaging |
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E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China