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High reactivity with amine and anhydride curing agents for rapid gelation and short cycle times.
Excellent adhesion to metals, composites, and cured polymer substrates.
Low viscosity (10,000–12,000 cP at 25°C) enabling easy processing, impregnation, and flow control.
Good thermal stability with glass transition temperature (Tg) up to 125°C after full cure.
Low chloride content (<0.05%) ensuring high electrical insulation performance and corrosion resistance.
Electrical encapsulation and potting of transformers, reactors, and high-voltage insulators.
Structural adhesive formulations for aerospace composite bonding and automotive lightweight assemblies.
Matrix resin for filament-wound pressure vessels and fiber-reinforced pipes.
Tooling and mold-making compounds requiring dimensional stability and low exotherm.
High-performance laminating resin for printed circuit board (PCB) prepregs and copper-clad laminates.
| Chemical Type | Bisphenol-A based liquid epoxy resin |
| Product Form | Clear to pale yellow viscous liquid |
| Appearance | Homogeneous, transparent, free from gels or suspended particles |
| Epoxy Equivalent Weight (EEW) | 185–195 g/eq |
| Viscosity (25°C) | 10,000–12,000 cP |
| Chloride Content | ≤0.05 wt% |
| Softening Point | Not applicable (liquid at room temperature) |
| Primary Applications | Encapsulation, structural adhesives, filament winding, tooling |
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E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
