High reactivity with standard amine and anhydride hardeners for rapid cure at ambient or elevated temperatures.
Excellent chemical resistance to alkalis, dilute acids, and solvents after full curing.
Low viscosity (12,000–15,000 cP at 25°C) enabling easy processing, impregnation, and flow in complex molds.
Superior electrical insulation properties with high dielectric strength and volume resistivity.
Good adhesion to metals, glass, and composite substrates without primer requirement.
Electrical encapsulation of transformers, reactors, and high-voltage insulators.
Potting compounds for power electronics, PCB modules, and LED drivers.
Structural bonding adhesives in wind turbine blade assembly and rail vehicle components.
Matrix resin for filament-wound pressure vessels and FRP piping systems.
Coating formulations for corrosion-resistant linings in chemical storage tanks.
| Chemical Type | Bisphenol-A based liquid epoxy resin |
| Product Form | Clear to pale yellow viscous liquid |
| Appearance | Homogeneous, transparent, free from gels or particulates |
| Epoxy Equivalent Weight (EEW) | 185–195 g/eq |
| Viscosity (25°C) | 12,000–15,000 cP |
| Chlorine Content | ≤ 700 ppm (total chlorine) |
| Softening Point | 12–15°C |
| Storage Stability | 12 months at ≤ 25°C in sealed original packaging |
Contact With Us:
E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China