High purity bisphenol-A based liquid epoxy resin with low ionic chloride content.
Excellent compatibility with standard amine and anhydride curing agents.
Consistent viscosity and epoxy equivalent weight for reliable process control.
Superior electrical insulation properties suitable for high-performance encapsulation.
Low color value (APHA ≤ 15) ensuring clarity in transparent coating and casting applications.
Electrical & electronic encapsulants and potting compounds.
High-voltage insulators and bushing resins.
Structural adhesives for aerospace and automotive composites.
UV-curable hybrid formulations requiring low shrinkage and high crosslink density.
Prepreg matrices for fiber-reinforced laminates.
| Chemical Type | Bisphenol-A epoxy resin |
| Product Form | Clear, pale yellow liquid |
| Appearance | Transparent, free from suspended matter |
| Epoxy Equivalent Weight (EEW) | 183–192 g/eq |
| Viscosity at 25°C | 11,000–14,000 cP |
| Chloride Content | ≤ 800 ppm |
| Color (APHA) | ≤ 15 |
| Softening Point | Not applicable (liquid at room temperature) |
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E-mail: wangxingqiang@ericwchem.com
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