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High reactivity with amine and anhydride curing agents, enabling rapid gelation and short cycle times.
Excellent adhesion to metals, composites, and fiber-reinforced substrates without primer requirement.
Low viscosity at room temperature (approx. 800–1,200 cP), facilitating easy handling, impregnation, and processing.
Superior electrical insulation properties with high dielectric strength and low dissipation factor.
Good thermal stability with glass transition temperature (Tg) of ~135–145°C after post-cure.
Electrical encapsulation and potting compounds for power electronics and EV battery modules.
Structural adhesive formulations for aerospace composite bonding and automotive lightweight assemblies.
Prepreg matrix resin for carbon fiber reinforced polymer (CFRP) laminates in wind turbine blades.
Coating systems for corrosion protection of offshore steel infrastructure and chemical process equipment.
Insulating varnishes for high-voltage motor and generator windings.
| Chemical Type | Diglycidyl ether of bisphenol-F (DGEBF) epoxy resin |
| Product Form | Liquid, low-viscosity clear to pale yellow |
| Appearance | Transparent, slightly viscous liquid |
| Epoxy Equivalent Weight (EEW) | 165–175 g/eq |
| Viscosity (25°C) | 900–1,100 cP |
| Chloride Content | < 800 ppm |
| Volatiles Content | < 0.3 wt% |
| Storage Stability | 12 months at 25°C in sealed original container |
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E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
