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High-purity bisphenol-A based liquid epoxy resin with consistent epoxide equivalent weight (EEW).
Excellent thermal stability and low volatility, supporting safe handling in industrial processing.
Optimized viscosity for enhanced processability in casting, impregnation, and coating applications.
Superior adhesion to metals, composites, and cured polymer substrates.
Low chloride content ensuring high electrical insulation performance and corrosion resistance.
Electrical insulation systems for transformers, reactors, and high-voltage bushings.
Structural adhesive formulations in aerospace and automotive composite bonding.
Encapsulation and potting compounds for electronic modules and power electronics.
Reinforced laminates in printed circuit board (PCB) prepreg and base materials.
High-performance coatings for corrosion protection of steel infrastructure and pipelines.
| Chemical Type | Bisphenol-A diglycidyl ether (DGEBA) |
| Product Form | Clear, low-viscosity liquid |
| Appearance | Colorless to pale yellow, transparent |
| Epoxide Equivalent Weight (EEW) | 185–192 g/eq |
| Viscosity at 25°C | 12,000–15,000 cP |
| Chloride Content | ≤ 500 ppm |
| Softening Point | 12–16°C |
| Storage Stability | ≥ 12 months at <25°C in sealed containers |
Contact With Us:
E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
