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High-purity bisphenol-A based liquid epoxy resin with consistent molecular weight distribution.
Excellent compatibility with standard amine and anhydride curing agents for broad formulation flexibility.
Low viscosity (11,000–13,000 cP at 25°C) enabling easy processing, mixing, and impregnation.
Superior electrical insulation properties and low dielectric loss suitable for electronic encapsulation.
Good thermal stability and hydrolytic resistance for long-term performance in demanding environments.
Electrical & electronic encapsulants and potting compounds.
High-voltage insulators and castings for power transmission equipment.
Structural adhesives for aerospace and automotive composite bonding.
Wind turbine blade matrix resins and rotor hub bonding systems.
Prepregs and filament-wound composites requiring high glass transition temperature.
| Chemical Type | Bisphenol-A epoxy resin |
| Product Form | Clear, low-viscosity liquid |
| Appearance | Water-white to pale yellow, transparent |
| Epoxy Equivalent Weight (EEW) | 185–192 g/eq |
| Viscosity (25°C) | 11,000–13,000 cP |
| Chlorine Content | ≤ 700 ppm |
| Softening Point | 12–15°C |
| Storage Stability | Stable for ≥12 months at 20–25°C in sealed containers |
Contact With Us:
E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
