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High-purity bisphenol-A based liquid epoxy resin with consistent molecular weight distribution.
Excellent compatibility with standard amine and anhydride curing agents for broad formulation flexibility.
Low viscosity (11,000–13,000 cP at 25°C) enabling easy processing, mixing, and impregnation.
Superior electrical insulation properties and low dielectric loss suitable for electronic encapsulation.
Good thermal stability and hydrolytic resistance for long-term performance in demanding environments.
Electrical & electronic encapsulants and potting compounds.
High-voltage insulators and castings for power transmission equipment.
Structural adhesives for aerospace and automotive composite bonding.
Wind turbine blade matrix resins and rotor hub bonding systems.
Prepregs and filament-wound composites requiring high glass transition temperature.
| Chemical Type | Bisphenol-A epoxy resin |
| Product Form | Clear, low-viscosity liquid |
| Appearance | Water-white to pale yellow, transparent |
| Epoxy Equivalent Weight (EEW) | 185–192 g/eq |
| Viscosity (25°C) | 11,000–13,000 cP |
| Chlorine Content | ≤ 700 ppm |
| Softening Point | 12–15°C |
| Storage Stability | Stable for ≥12 months at 20–25°C in sealed containers |
Q1: What is the primary chemical structure and functionality of YD-112?
A: YD-112 is a bisphenol-A based liquid epoxy resin with an average epoxide functionality of approximately 2.0–2.2 per molecule, offering balanced reactivity and crosslink density for thermoset applications.
Q2: Is YD-112 suitable for high-gloss coatings and electrical encapsulation?
A: Yes — its low viscosity, excellent clarity, and good adhesion to metals and composites make it widely used in protective coatings, insulating varnishes, and electronic potting compounds where dielectric performance and surface aesthetics are critical.
Q3: How does YD-112 compare to solid epoxy resins like E-20 or E-44 in processing?
A: As a low-viscosity liquid at room temperature, YD-112 enables easier handling, solvent-free formulations, and improved wetting of fillers or fibers—eliminating the need for heating or extended mixing typically required with solid-grade resins.
Q4: What types of curing agents are commonly paired with YD-112?
A: It exhibits broad compatibility with amine-based hardeners (aliphatic, cycloaliphatic, and aromatic), anhydrides, and latent catalysts—selection depends on the desired cure schedule, thermal resistance, and mechanical property profile.
Q5: Can YD-112 be modified to enhance flexibility or impact resistance?
A: Yes — it is routinely blended with reactive diluents, rubber modifiers (e.g., CTBN), or flexible epoxy prepolymers to tailor toughness, elongation, and thermal shock resistance without compromising core epoxy performance.
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E-mail: wangxingqiang@ericwchem.com
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