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High-purity bisphenol-A based liquid epoxy resin with low ionic impurities.
Excellent thermal stability and consistent reactivity for precise process control.
Low viscosity (10,000–12,000 cP at 25°C) enabling easy handling and uniform dispersion.
Superior adhesion to metals, composites, and cured polymer substrates.
Optimized for high-performance electrical encapsulation and laminating applications.
Electrical insulation systems for power transformers and reactors.
Encapsulation of high-voltage electronic components and sensors.
Prepreg and laminated composite matrices in aerospace structural parts.
High-reliability potting compounds for automotive power electronics.
Base resin for specialty casting and high-gloss coating formulations.
| Chemical Type | Bisphenol-A epoxy resin |
| Product Form | Clear, low-viscosity liquid |
| Appearance | Pale yellow to colorless, transparent |
| Epoxy Equivalent Weight (EEW) | 185–192 g/eq |
| Viscosity (25°C) | 10,000–12,000 cP |
| Chloride Content | ≤ 100 ppm |
| Softening Point | Not applicable (liquid at room temperature) |
| Storage Stability | ≥ 12 months at <25°C in sealed containers |
Contact With Us:
E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
