High purity bisphenol-A based liquid epoxy resin with consistent epoxide equivalent weight (EEW).
Excellent adhesion to metals, glass, and composite substrates under ambient and elevated curing conditions.
Low viscosity (10,000–12,000 cP at 25°C) enabling easy processing, mixing, and impregnation.
Superior chemical resistance to alkalis, dilute acids, and common solvents after full cure.
Good thermal stability with glass transition temperature (Tg) of cured system up to 120°C.
Structural adhesives for aerospace and automotive bonding applications.
Matrix resin for fiber-reinforced composites in wind turbine blades and sporting goods.
Electrical encapsulation and potting compounds for transformers and power electronics.
Coating systems for corrosion protection of steel infrastructure and marine equipment.
Formulation base for high-performance prepregs and filament winding resins.
| Chemical Type | Bisphenol-A diglycidyl ether (DGEBA) |
| Product Form | Clear, low-viscosity liquid |
| Appearance | Colorless to pale yellow, transparent |
| Epoxide Equivalent Weight (EEW) | 185–192 g/eq |
| Viscosity (25°C) | 10,000–12,000 mPa·s |
| Chloride Content | ≤ 1,000 ppm |
| Volatiles Content | ≤ 0.5 wt% |
| Storage Stability | 12 months at ≤ 25°C in sealed containers |
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E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China