English
Español
tiếng việt
русский
High reactivity with amine and anhydride hardeners, enabling rapid cure at ambient or elevated temperatures.
Excellent adhesion to metals, composites, and cured polymer substrates without extensive surface pretreatment.
Low viscosity (1200–1500 mPa·s at 25°C) for easy processing, impregnation, and void-free casting.
Superior electrical insulation properties with volume resistivity >1.0 × 10¹³ Ω·cm after full cure.
Good UV stability and long-term thermal resistance up to 130°C continuous use (UL 94 V-0 rated when formulated).
Electrical encapsulation and potting of power modules, transformers, and high-voltage sensors.
Structural adhesive formulations for aerospace composite bonding and automotive lightweight assemblies.
Matrix resin in filament-wound pressure vessels and carbon fiber reinforced tanks.
Underfill and glob-top materials for semiconductor packaging and MEMS device protection.
High-performance coating systems for corrosion-resistant linings in chemical process equipment.
| Chemical Type | Diglycidyl ether of bisphenol-F (BPF-type epoxy) |
| Product Form | Clear, low-viscosity liquid |
| Appearance | Amber to pale yellow, transparent |
| Epoxy Equivalent Weight (EEW) | 178–185 g/eq |
| Viscosity (25°C) | 1200–1500 mPa·s |
| Chloride Content | ≤ 500 ppm |
| Softening Point | Not applicable (liquid at room temperature) |
| Primary Applications | Encapsulation, structural adhesives, composite matrices, protective coatings |
Contact With Us:
E-mail: wangxingqiang@ericwchem.com
Have a Questions? Call Us:
Add:
Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
