High reactivity with amine and anhydride hardeners for rapid cure at ambient or elevated temperatures.
Excellent chemical resistance to alkalis, dilute acids, and solvents after full curing.
Low viscosity (8,000–12,000 cP at 25°C) enabling easy processing, impregnation, and bubble-free casting.
Superior electrical insulation properties with high dielectric strength and volume resistivity.
Good adhesion to metals, glass, and composite substrates without mandatory surface priming.
Electrical encapsulation of transformers, reactors, and high-voltage insulators.
Potting and encapsulation of power electronics, PCBs, and LED modules.
Structural bonding in aerospace and automotive composite assemblies.
Manufacturing of filament-wound pressure vessels and FRP tanks.
Base resin for high-performance laminating systems in wind turbine blade fabrication.
| Chemical Type | Bisphenol-A based liquid epoxy resin |
| Product Form | Clear, amber-colored viscous liquid |
| Appearance | Homogeneous, transparent, free from gels and suspended particles |
| Epoxy Equivalent Weight (EEW) | 185–195 g/eq |
| Viscosity (25°C) | 8,000–12,000 cP |
| Chlorine Content | ≤ 700 ppm |
| Volatiles Content | ≤ 0.3 wt% |
| Storage Stability | 12 months at ≤ 25°C in sealed original packaging |
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E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China