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High-purity bisphenol-A based liquid epoxy resin with low chloride content.
Excellent compatibility with standard amine and anhydride curing agents.
Consistent viscosity and epoxide equivalent weight (EEW) for reliable process control.
Superior electrical insulation properties and thermal stability after curing.
Low volatile organic compound (VOC) emission, supporting eco-friendly manufacturing practices.
Electrical potting and encapsulation of transformers, reactors, and high-voltage components.
Structural adhesives for aerospace composite bonding and automotive under-hood assemblies.
Coatings for corrosion-resistant linings in chemical storage tanks and piping systems.
Matrix resin for fiber-reinforced composites used in wind turbine blades and marine structures.
Printed circuit board (PCB) laminates and prepreg systems requiring high Tg and dimensional stability.
| Chemical Type | Bisphenol-A diglycidyl ether (DGEBA) |
| Product Form | Clear to pale yellow liquid |
| Appearance | Homogeneous, transparent, free from gel or sediment |
| Epoxide Equivalent Weight (EEW) | 184–190 g/eq |
| Viscosity at 25°C | 12,000–15,000 cP |
| Chlorine Content (Total Cl) | ≤ 750 ppm |
| Softening Point | Not applicable (liquid at room temperature) |
| Primary Applications | High-performance composites, electrical insulation, protective coatings |
Contact With Us:
E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
