High-purity bisphenol-A based liquid epoxy resin with consistent molecular weight distribution.
Excellent compatibility with standard amine and anhydride curing agents for broad formulation flexibility.
Low volatility and low chloride content, supporting enhanced electrical insulation properties.
Optimized viscosity (12,000–14,000 cP at 25°C) for efficient processing in casting, impregnation, and coating applications.
Superior adhesion to metals, glass, and composites under ambient and elevated temperature conditions.
Electrical insulation systems for dry-type transformers and reactors.
Potting and encapsulation of high-voltage electronic components and sensors.
Structural adhesives requiring thermal stability and chemical resistance.
High-performance composite matrix resin for aerospace and wind turbine blade laminates.
Coating formulations for corrosion-resistant linings in industrial tanks and piping.
| Chemical Type | Bisphenol-A epoxy resin |
| Product Form | Clear, pale yellow viscous liquid |
| Appearance | Homogeneous, transparent, free from gel particles or sediment |
| Epoxy Equivalent Weight (EEW) | 475–495 g/eq |
| Viscosity (25°C) | 12,000–14,000 cP |
| Chloride Content | ≤ 800 ppm |
| Softening Point | 10–15°C |
| Storage Stability | ≥ 12 months at 25°C in sealed containers |
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E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China