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Enhanced thermal stability up to 200 °C, minimizing luminance decay under high-power LED operation.
Broad excitation spectrum (350–480 nm), enabling efficient compatibility with near-UV and blue InGaN chip emissions.
Improved quantum efficiency (>92% at 450 nm excitation) due to optimized crystal lattice modification and surface passivation.
Reduced afterglow and negligible thermal quenching below 150 °C, supporting consistent color point maintenance in dynamic lighting environments.
Controlled particle size distribution (D50 = 8.2 ± 0.5 µm) for uniform dispersion in silicone and epoxy encapsulants.
High-CRI general illumination LEDs (e.g., downlights, panel lights, and streetlights requiring Ra > 95).
Automotive headlamp and daytime running light (DRL) modules demanding robust thermal performance and long-term reliability.
Projection display systems and laser-phosphor hybrid light engines where narrow emission bandwidth and high saturation are critical.
Horticultural LED lighting systems requiring precise red-orange spectral output (peak ~615 nm) for phytochrome activation.
UV-pumped white LEDs for medical and sterilization-grade ambient lighting with low UV leakage and high photostability.
| Chemical Type | Modified Eu²⁺-activated (Ca,Sr)AlSiN₃ solid solution |
| Product Form | Free-flowing fine powder |
| Appearance | Orange-red crystalline powder |
| Primary Emission Peak | 612–618 nm (FWHM ≈ 75 nm) |
| Excitation Range | 350–480 nm (max at 455 nm) |
| Key Features | Lattice-stabilized nitride structure with Al/Si ratio tuning and AlN-based surface coating |
| Benefits | Higher lumen maintenance (>95% @ 6,000 h, 85 °C/85% RH), reduced phosphor settling in dispersions |
| Regulatory Compliance | REACH SVHC-free; RoHS 3 (2015/863/EU) compliant; no intentionally added cadmium, lead, or mercury |
| Common Compatible Systems | Suitability |
| LED Encapsulant: Addition-cure silicone (e.g., Dow SYLGARD™ 184 derivatives) | Highly Recommended – Excellent dispersion stability and minimal interfacial degradation at 150 °C |
| LED Encapsulant: Epoxy resins (e.g., Sumitomo EPX series) | Recommended – Requires pre-drying and controlled mixing to prevent moisture-induced agglomeration |
| Phosphor Dispersion Medium: Isopropanol / terpineol-based carrier systems | Highly Recommended – Achieves <5% particle aggregation after 72 h static storage |
| Manufacturing Process: Jet-milling and spray-drying integration lines | Suitable – Fully compatible with standard phosphor grading and classification equipment (e.g., Hosokawa Alpine classifiers) |
Q1: What is the CAS Registry Number for this phosphor?
A: This is a proprietary multi-component crystalline material without a single CAS number; it is registered under EC No. 940-001-0 as a defined UVCB substance per EU REACH guidelines.
Q2: What is the recommended loading concentration in silicone encapsulants?
A: Typical loading range is 12–18 wt% relative to total encapsulant mass; optimal performance is achieved at 15.5 ± 0.8 wt% for warm-white (3000K, CRI >95) configurations.
Q3: How does this modified nitride phosphor compare to conventional (Sr,Ca)AlSiN₃ in terms of migration resistance?
A: Surface-modified particles exhibit >99.7% retention after 1,000 h HAST (130 °C/85% RH), significantly outperforming uncoated equivalents (<85% retention) due to hydrophobic AlN shell inhibition of ion leaching.
Q4: Is this phosphor compliant with IEC 62471 for photobiological safety in LED lamps?
A: Yes — when formulated into standard white LED packages (e.g., 3535 or 5050 SMD), the final lamp system meets Exempt Group requirements per IEC 62471:2006 and EN 62471:2008, verified by third-party spectral radiance testing.
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