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High purity bisphenol A-based epoxy resin with consistent epoxide equivalent weight (EEW) for reliable reactivity control.
Excellent thermal stability and low volatility, supporting high-temperature curing processes without premature degradation.
Superior adhesion to metals, composites, and cured thermosets—ideal for structural bonding and coating systems.
Low ionic chloride content (< 500 ppm), minimizing corrosion risk in electronic encapsulation and metal-coating applications.
Optimized molecular weight distribution for balanced viscosity, pot life, and final crosslink density.
Electrical insulation coatings for transformers, busbars, and high-voltage components.
Structural adhesives in aerospace and automotive composite assemblies.
Prepreg matrix resin for carbon fiber and glass fiber reinforced laminates.
Encapsulants and glob-tops for semiconductor packaging and power modules.
High-performance powder coating binders requiring excellent flow, leveling, and edge coverage.
| Chemical Type | Bisphenol A diglycidyl ether (DGEBA) epoxy resin |
| Product Form | Amber to light yellow viscous liquid |
| Appearance | Clear, homogeneous, free from gels or suspended particles |
| Epoxide Equivalent Weight (EEW) | 185–192 g/eq |
| Viscosity (25°C) | 12,000–16,000 cP |
| Chlorine Content (Total) | ≤ 500 ppm |
| Softening Point | 12–16°C |
| Hydrolyzable Chloride | ≤ 100 ppm |
Contact With Us:
E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
