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High purity bisphenol A-based epoxy resin with consistent molecular weight distribution.
Excellent thermal stability and low ionic impurity content for enhanced electrical insulation performance.
Optimized viscosity for easy handling, solvent-free processing, and compatibility with standard curing agents.
Superior adhesion to metals, glass, and composites under humid and elevated temperature conditions.
Low color value (APHA ≤ 15) ensuring clarity in transparent coatings and optical-grade encapsulants.
Electrical insulation systems for dry-type transformers and reactor windings.
Encapsulants and potting compounds for power electronics and LED modules.
High-performance composite matrices in aerospace and wind turbine blade manufacturing.
Adhesives for structural bonding in automotive and rail transport components.
Base resin for high-gloss, chemical-resistant industrial floor coatings.
| Chemical Type | Bisphenol A diglycidyl ether (DGEBA) epoxy resin |
| Product Form | Clear, pale yellow viscous liquid |
| Appearance | Homogeneous liquid, free of gels or suspended particles |
| Epoxy Equivalent Weight (EEW) | 185–192 g/eq |
| Viscosity at 25°C | 10,000–14,000 mPa·s |
| Chlorine Content (Total Cl) | ≤ 800 ppm |
| Color (APHA) | ≤ 15 |
| Softening Point | Not applicable (liquid at room temperature) |
Contact With Us:
E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
