Guangzhou Eric Wei Chemical Co., Ltd.
Guangzhou Eric Wei Chemical Co., Ltd.

Sanwa KINGMIDE-305-70 Epoxy Curing Agent

Sanwa KINGMIDE-305-70 is a high-performance epoxy curing agent from Sanwa’s KINGMIDE series, formulated for rapid ambient-cure applications. It delivers excellent adhesion, chemical resistance, and thermal stability in composites, coatings, and adhesives. Low viscosity and extended pot life enhance processability. Compliant with RoHS, it supports eco-friendly manufacturing without compromising mechanical strength or durability.
  • sanwa kingmide 305 70 epoxy curing agent_58c9c7ee
  • sanwa kingmide 305 70 epoxy curing agent_58c9c7ee

Features Of Sanwa KINGMIDE-305-70 Epoxy Curing Agent

  1. Low-viscosity liquid formulation enabling excellent mixability with standard epoxy resins.

  2. Room-temperature curing capability with balanced pot life and rapid development of mechanical strength.

  3. High thermal stability and excellent chemical resistance post-cure, particularly against solvents and weak acids.

  4. Low volatility and minimal odor, supporting safer handling in ventilated industrial environments.

  5. Compatible with bisphenol-A and novolac epoxy systems for broad formulation flexibility.

Typical Applications Of Sanwa KINGMIDE-305-70 Epoxy Curing Agent

  1. Electrical encapsulation and potting compounds for power electronics and transformers.

  2. Structural adhesives in automotive and rail transportation assemblies.

  3. Protective coatings for metal substrates in industrial maintenance and corrosion protection.

  4. Composite matrix resins for filament-wound pipes and pressure vessels.

  5. Tooling and mold-making compounds requiring dimensional stability and low exotherm.

Specifications Of Sanwa KINGMIDE-305-70 Epoxy Curing Agent

Chemical TypeAmine-based aliphatic polyamine adduct
Product FormClear to pale yellow liquid
AppearanceHomogeneous, free of sediment or haze
Specific Gravity (25°C)0.98–1.02 g/cm³
Viscosity (25°C)350–550 mPa·s
Amine Value380–420 mg KOH/g
Reactivity ProfileMedium reactivity; gel time ~60–90 min at 25°C with DGEBA resin (1:1 w/w)
Storage Stability≥12 months at 5–25°C in sealed original container


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