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Latent curing agent with excellent storage stability at room temperature.
Activates rapidly at elevated temperatures (typically >120 °C), enabling precise processing control.
Delivers high glass transition temperature (Tg) and superior mechanical properties in cured epoxy systems.
Low volatility and low odor, supporting safer handling and improved workplace environment.
Compatible with standard DGEBA-type epoxies and specialty resins for broad formulation flexibility.
Aerospace composite prepregs requiring precise cure scheduling and high thermal performance.
Electronics encapsulation and underfill materials demanding low ionic impurities and reliability.
High-performance adhesives for structural bonding in automotive and rail applications.
Carbon fiber reinforced polymer (CFRP) tooling and mold-making compounds.
Electrically insulating potting compounds for power electronics and EV battery modules.
| Chemical Type | 2-Methylimidazole derivative (cyanomethyl-substituted) |
| Product Form | Off-white to light tan crystalline powder |
| Appearance | Free-flowing crystalline solid |
| Molecular Weight | Approx. 135 g/mol |
| Assay (Purity) | ≥98.0% (by GC) |
| Decomposition Onset Temperature | ~145 °C (DSC, 10 °C/min) |
| Primary Applications | Epoxy resin curing for composites, electronics, and structural adhesives |
| Key Features | Latency, thermal activation, low volatility, high Tg promotion |
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