Guangzhou Eric Wei Chemical Co., Ltd.
Guangzhou Eric Wei Chemical Co., Ltd.

Sanho Chemical KINKINGMIDE-549 Polyamide Resin

Sanho Chemical KINKINGMIDE-549 Polyamide Resin is a high-performance thermoplastic polyamide resin from the KINKINGMIDE series, engineered for superior adhesion, flexibility and chemical resistance in industrial coatings and adhesive formulations. It delivers excellent film-forming ability, thermal stability up to 180°C, and compatibility with epoxy, phenolic and rubber systems. Widely used in metal primers, flexible packaging laminates and automotive underhood applications.
  • sanho chemical kinkingmide 549 polyamide resin_d4096e25
  • sanho chemical kinkingmide 549 polyamide resin_d4096e25

Features Of Sanho Chemical KINKINGMIDE-549 Polyamide Resin

  1. High thermal stability with continuous service temperature up to 180 °C.

  2. Excellent chemical resistance against hydrocarbons, alcohols, and common industrial solvents.

  3. Outstanding adhesion to metals, polyolefins, and engineering thermoplastics.

  4. Low melt viscosity enabling easy processing via extrusion coating, hot-melt lamination, and powder spraying.

  5. Halogen-free formulation compliant with RoHS and REACH regulatory requirements.

Typical Applications Of Sanho Chemical KINKINGMIDE-549 Polyamide Resin

  1. Hot-melt adhesive for aluminum foil–paper laminates in pharmaceutical blister packaging.

  2. Coating binder for corrosion-resistant metal protective films in automotive under-hood components.

  3. Interlayer adhesive in multilayer coextruded barrier films for food and beverage flexible packaging.

  4. Bonding agent for composite overmolding of metal inserts into polyamide-based structural parts.

  5. Encapsulant matrix for high-reliability wire harnesses in industrial electronics.

Specifications Of Sanho Chemical KINKINGMIDE-549 Polyamide Resin

Chemical TypeAromatic-aliphatic copolyamide
Product FormPellets
AppearanceOff-white to light beige granules
Melt Flow Rate (230 °C / 2.16 kg)12–16 g/10 min
Melting Point (DSC, 10 °C/min)198–204 °C
Moisture Content (as received)≤ 0.2 wt%
Density (23 °C)1.08–1.12 g/cm³
Primary ApplicationsHot-melt adhesives, functional coatings, and multilayer bonding systems


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