English
Español
tiếng việt
русский
Low-temperature latent curing activity with excellent shelf stability at ambient conditions.
High reactivity with epoxy resins, enabling rapid gelation and full cure below 150 °C.
Minimal volatility and low odor, supporting safer handling and improved workplace hygiene.
Consistent batch-to-batch purity and narrow particle size distribution for reliable process control.
Enhanced interfacial adhesion in composite laminates and encapsulated electronic assemblies.
High-performance prepregs for aerospace and wind turbine blade composites.
Encapsulants and underfills for semiconductor packaging and MEMS devices.
Structural adhesives in automotive lightweighting and EV battery module bonding.
Electrical insulation varnishes for motors, transformers, and high-voltage components.
3D printing resins requiring precise thermal-triggered crosslinking kinetics.
| Chemical Type | Imidazole derivative (2-phenyl-4-methylimidazole adduct) |
| Product Form | White to off-white crystalline powder |
| Appearance | Free-flowing fine particles |
| Primary Applications | Epoxy resin curing agent for composites, electronics, and adhesives |
| Key Features | Latent, thermally activated, low-dusting |
| Recommended Storage | Below 25 °C, dry and dark conditions |
| Shelf Life | 24 months from date of manufacture when stored properly |
| Handling Precautions | Use in well-ventilated areas; avoid inhalation of dust |
Contact With Us:
E-mail: wangxingqiang@ericwchem.com
Have a Questions? Call Us:
Add:
Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
