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High reactivity with epoxy resins at elevated temperatures, enabling rapid and efficient crosslinking.
Excellent thermal stability, supporting high-performance composite applications up to 200°C continuous use.
Low volatility and minimal odor, improving workplace safety and handling convenience.
Precise stoichiometric control for consistent cure kinetics and reproducible mechanical properties.
Compatible with a broad range of epoxy systems, including liquid, solid, and novolac-based formulations.
Aerospace-grade structural adhesives requiring high Tg and dimensional stability.
Electronics encapsulation and underfill materials for advanced semiconductor packaging.
High-performance carbon fiber reinforced polymer (CFRP) composites in wind turbine blades and automotive components.
Electrical insulation varnishes and coil coatings for motors and transformers.
Prepregs and filament-wound composites demanding low exotherm and extended pot life.
| Chemical Type | Imidazole derivative |
| Product Form | White to off-white crystalline powder |
| Appearance | Free-flowing crystalline solid |
| Primary Applications | Epoxy resin curing agent for high-Tg composites and electronics |
| Key Features | Thermal latency, sharp cure onset, low activation energy |
| Benefits | Extended shelf life, reduced post-cure requirements, enhanced interlaminar shear strength |
| Storage Condition | Store in original sealed container at 5–25°C, protect from moisture |
| Handling Precaution | Use in well-ventilated areas; avoid inhalation of dust and skin contact |
Contact With Us:
E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
