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Highly efficient latent curing agent for epoxy resins with excellent storage stability at room temperature.
Activates rapidly upon heating, enabling precise control over gel time and cure profile in thermal processing.
Delivers superior mechanical properties and thermal resistance in cured epoxy composites.
Low volatility and minimal odor, supporting safer handling and improved workplace environmental compliance.
Compatible with a broad range of liquid and solid epoxy resins, including DGEBA, novolacs, and multifunctional epoxies.
Prepregs and laminates for aerospace structural components.
Electronics encapsulants and underfill materials requiring low-temperature curability.
High-performance composite tooling and molds for automotive and wind energy sectors.
Adhesives for metal-to-metal and composite bonding in demanding industrial environments.
3D printing resin systems requiring thermal-triggered, shelf-stable curing chemistry.
| Chemical Type | Imidazole derivative (2-ethyl-4-methylimidazole adduct) |
| Product Form | Powder |
| Appearance | White to off-white crystalline powder |
| Primary Applications | Epoxy resin curing agent for composites, adhesives, and encapsulants |
| Key Features | Latent, thermally activated, low volatility, high reactivity post-activation |
| Benefits | Extended pot life, sharp cure onset, enhanced Tg and chemical resistance |
| Storage Conditions | Store sealed under dry conditions at 5–25°C; protect from moisture and direct sunlight |
| Shelf Life | 24 months from date of manufacture when stored properly |
Contact With Us:
E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
