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Low-temperature latent curing activity with onset around 100 °C, enabling precise processing control.
High thermal stability and extended pot life at room temperature for improved handling and formulation flexibility.
Excellent compatibility with epoxy resins, including solid and liquid bisphenol-A and novolac types.
Minimal volatility and low odor, supporting safer industrial handling and compliance with workplace hygiene standards.
Enables high glass transition temperature (Tg) and superior mechanical properties in cured thermosets.
Prepregs and filament-wound composites for aerospace and wind energy components.
Electrical laminates and printed circuit board (PCB) substrates requiring high dimensional stability.
Structural adhesives for automotive and rail transportation bonding applications.
Encapsulants and potting compounds for power electronics and LED modules.
Carbon fiber-reinforced polymer (CFRP) tooling and mold-making materials.
| Chemical Type | Imidazole derivative (2-phenyl-4-methylimidazole adduct) |
| Product Form | Powder |
| Appearance | White to off-white crystalline powder |
| Primary Applications | Epoxy resin curing agent for high-performance composites and electronics |
| Key Features | Latent, low-dusting, non-hygroscopic |
| Recommended Storage | Below 25 °C, dry and well-ventilated environment |
| Shelf Life | 24 months from date of manufacture under recommended storage conditions |
| Handling Precautions | Use in well-ventilated areas; avoid inhalation of dust and direct skin contact |
Contact With Us:
E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
