English
Español
tiếng việt
русский
High-purity bisphenol-A based liquid epoxy resin with low chlorine content.
Excellent compatibility with standard amine and anhydride curing agents.
Low viscosity (12,000–14,000 cP at 25°C) enabling easy handling and processing.
Superior electrical insulation properties and dielectric strength.
Good thermal stability and adhesion to metals, glass, and composites.
Electrical encapsulation of transformers, reactors, and high-voltage insulators.
Matrix resin for filament-wound composite pressure vessels.
Adhesives for structural bonding in aerospace and rail components.
Coating formulations for corrosion-resistant linings in chemical equipment.
Prepregs and laminates for printed circuit board (PCB) substrates.
| Chemical Type | Bisphenol-A epoxy resin |
| Product Form | Clear, pale yellow liquid |
| Appearance | Transparent, slightly viscous liquid |
| Epoxy Equivalent Weight (EEW) | 185–192 g/eq |
| Viscosity (25°C) | 12,000–14,000 cP |
| Chlorine Content | ≤ 800 ppm |
| Softening Point | Not applicable (liquid at room temperature) |
| Density (25°C) | 1.16–1.18 g/cm³ |
Contact With Us:
E-mail: wangxingqiang@ericwchem.com
Have a Questions? Call Us:
Add:
Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
