Low-viscosity liquid polyamide offering excellent compatibility with epoxy resins.
Provides balanced pot life and rapid ambient-temperature cure kinetics.
Delivers superior flexibility and impact resistance in cured epoxy systems.
Exhibits low exotherm during curing, reducing thermal stress in thick-section applications.
Complies with RoHS Directive and meets stringent regulatory requirements for industrial coatings.
Industrial maintenance coatings for steel structures and pipelines.
Electrical insulation systems in transformers and encapsulated components.
Adhesives for metal-to-metal and composite bonding in transportation equipment.
Repair mortars and grouts requiring ambient-cure performance and chemical resistance.
| Chemical Type | Polyamide adduct |
| Product Form | Liquid |
| Appearance | Amber to light brown transparent liquid |
| Amine Value (mg KOH/g) | 350–410 |
| Viscosity at 25°C (mPa·s) | 800–1,500 |
| Specific Gravity (25°C) | 0.95–1.02 |
| Flash Point (PMCC, °C) | ≥120 |
| Storage Stability | Stable for ≥12 months at 5–30°C in sealed containers |
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E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China