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Non-toxic, water-miscible formulation with low volatility and minimal mist generation.
Enhanced thermal stability to prevent wire overheating and maintain consistent cutting performance under high-speed operation.
Superior lubricity and film strength that reduce diamond bead wear and extend wire life by up to 25%.
pH-stabilized (8.2–8.8) to inhibit corrosion on steel wire cores and machine components.
Biodegradable base fluid compliant with OECD 301B screening criteria for ready biodegradability.
Wire sawing of silicon ingots in photovoltaic (PV) wafer manufacturing.
Precision cutting of sapphire substrates for LED and semiconductor applications.
Quarrying and slabbing of granite, marble, and engineered stone in construction materials processing.
Cutting of ceramic composites and advanced refractory materials in aerospace component fabrication.
Recycling operations involving silicon-based electronic scrap and end-of-life solar panels.
| Chemical Type | Synthetic, non-ionic water-miscible concentrate |
| Product Form | Clear, amber liquid concentrate (ready-to-dilute) |
| Appearance | Homogeneous, slightly viscous liquid; no phase separation |
| Primary Applications | Diamond wire sawing of hard, brittle, and crystalline materials |
| Key Features | Low foaming, high wetting ability, non-staining, non-silicone |
| Benefits | Reduced wire breakage, improved surface finish, extended fluid sump life |
| Regulatory Compliance | REACH SVHC-free; RoHS-compliant; no listed Prop 65 carcinogens |
| Storage Stability | 24 months unopened at 5–30°C; stable after dilution for ≥7 days in recirculating systems |
| Common Compatible Systems | Suitability |
| Mitsubishi Diamond Wire Saw (DW-3000 series) | Highly Recommended – Optimized flow rate and pressure response; validated in OEM field trials |
| Omnitech OWS-5000 Wire Saw | Recommended – Requires standard dilution ratio (1:20 v/v); compatible with existing filtration units |
| Meihua MW-8000 High-Tension Wire Saw | Suitable – Confirmed compatibility with stainless steel guide rollers and polyurethane tension belts |
| Custom-built multi-axis diamond wire systems (industrial scale) | Suitable – Compatible with standard centrifugal and bag filtration; no emulsifier interference observed |
Q1: What is the CAS Registry Number for this product?
A: The proprietary blend does not have a single CAS number; individual constituents are disclosed in the Safety Data Sheet (SDS Section 3), with primary base fluid assigned CAS 9003-11-6 (polyalkylene glycol, avg. MW 400).
Q2: What is the recommended working concentration range?
A: Dilute at 4–6% v/v (1:16 to 1:24) in deionized or softened water (hardness < 50 ppm CaCO₃); optimal performance confirmed at 5% for most silicon and sapphire applications.
Q3: How does it compare to traditional oil-based or glycol-based wire fluids?
A: Unlike mineral oil fluids, it eliminates fire risk and VOC emissions; versus conventional glycols, it delivers higher lubricity without sticky residue buildup or bacterial growth in sumps.
Q4: Is migration or leaching into cut substrates a concern for electronic-grade silicon?
A: No detectable migration observed per ICP-MS analysis (detection limit < 0.1 ppb Na/K/Ca/Mg) after standard post-cut rinse protocols; verified by independent lab testing for PV wafer production.
Q5: Does it meet ISO 14001 or other environmental management system requirements?
A: Yes — fully aligned with ISO 14001:2015 operational control clauses; SDS and EcoVadis sustainability report available upon request for certified procurement workflows.
Contact With Us:
E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
