High-purity, low-chloride bisphenol-A based liquid epoxy resin with excellent hydrolytic stability.
Optimized molecular weight distribution for balanced reactivity and low viscosity processing.
Consistent batch-to-batch performance validated through rigorous quality control per ASTM D1767.
Low volatile organic compound (VOC) content, supporting industrial compliance with environmental regulations.
Enhanced compatibility with common amine and anhydride curing agents for broad formulation flexibility.
Electrical encapsulation and potting compounds for transformers, capacitors, and sensors.
High-performance composite matrices in aerospace and wind energy blade manufacturing.
Structural adhesives requiring thermal resistance and long-term durability.
Coatings for metal substrates demanding corrosion protection and chemical resistance.
Prepreg systems for advanced carbon fiber reinforced polymer (CFRP) laminates.
| Chemical Type | Bisphenol-A diglycidyl ether (DGEBA) epoxy resin |
| Product Form | Clear, low-viscosity liquid |
| Appearance | Water-white to pale yellow, transparent |
| Epoxy Equivalent Weight (EEW) | 185–192 g/eq |
| Viscosity at 25°C | 12,000–16,000 cP |
| Chlorine Content | ≤ 800 ppm |
| Volatiles Content | ≤ 0.3 wt% |
| Primary Applications | Encapsulation, composites, adhesives, coatings |
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E-mail: wangxingqiang@ericwchem.com
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