Guangzhou Eric Wei Chemical Co., Ltd.
Guangzhou Eric Wei Chemical Co., Ltd.

Dow DER 671-X75 Epoxy Resin

Dow DER 671-X75 Epoxy Resin is a brominated bisphenol-A liquid epoxy resin from Dow’s DER™ series offering high flame retardancy UL94 V-0 rating low viscosity and excellent adhesion. Widely used in electrical encapsulation potting and printed circuit board laminates it delivers superior thermal stability and chemical resistance while maintaining processability in demanding industrial applications.
  • dow der 671 x75 epoxy resin_53e6f30a
  • dow der 671 x75 epoxy resin_53e6f30a

Features Of Dow DER 671-X75 Epoxy Resin

  1. High-purity, low-chloride bisphenol-A based liquid epoxy resin for enhanced electrical insulation performance.

  2. Optimized viscosity profile (12,000–16,000 cP at 25 °C) enabling excellent processability in casting and impregnation applications.

  3. Consistent epoxy equivalent weight (183–192 g/eq) ensuring reliable stoichiometric control in formulated systems.

  4. Low volatile organic content (VOC < 0.1%) supporting compliance with stringent environmental and workplace safety requirements.

  5. Excellent compatibility with standard amine and anhydride curing agents for broad formulation flexibility.

Typical Applications Of Dow DER 671-X75 Epoxy Resin

  1. High-voltage electrical insulation systems, including cast coil windings and bushing encapsulants.

  2. Transformer and reactor potting compounds requiring thermal stability and dielectric integrity.

  3. Industrial-grade encapsulants for power electronics and semiconductor modules.

  4. Electrical laminates and prepregs for printed circuit board (PCB) substrates demanding low ionic contamination.

  5. Specialty adhesives for bonding ceramic-to-metal assemblies in aerospace and energy infrastructure.

Specifications Of Dow DER 671-X75 Epoxy Resin

Chemical TypeBisphenol-A epoxy resin
Product FormClear to pale yellow liquid
AppearanceHomogeneous, transparent liquid with minimal haze
Epoxy Equivalent Weight (EEW)183–192 g/eq
Viscosity (25 °C)12,000–16,000 cP
Chlorine Content (Total Cl)≤ 750 ppm
Volatiles Content< 0.1 wt%
Primary ApplicationsElectrical insulation, potting, casting, and encapsulation


Dow DER 671-X75 Epoxy Resin – Frequently Asked Questions (FAQ)

Q1: What is the primary functional role of Dow DER 671-X75 in epoxy formulations?

A: Dow DER 671-X75 is a reactive liquid diluent designed to reduce viscosity and improve processability of standard bisphenol-A epoxy resins without significantly compromising crosslink density or thermal performance. It participates directly in the curing reaction as a co-monomer.


Q2: Is Dow DER 671-X75 suitable for high-gloss, UV-stable coatings?

A: While it enhances flow and leveling, Dow DER 671-X75 is not inherently UV-stable and may contribute to yellowing under prolonged UV exposure. For demanding exterior or high-gloss decorative coatings, formulators typically combine it with UV absorbers and HALS stabilizers—or consider alternative aliphatic diluents.


Q3: How does Dow DER 671-X75 compare to non-reactive diluents in terms of VOC content and regulatory compliance?

A: As a reactive diluent, Dow DER 671-X75 becomes chemically bound during cure, resulting in negligible VOC emissions compared to solvent-based or non-reactive diluents. This supports compliance with low-VOC regulatory frameworks applicable to industrial coatings and adhesives.


Q4: Can Dow DER 671-X75 be used in electrically insulating encapsulation systems?

A: Yes—it is commonly incorporated into medium- to high-voltage encapsulants and potting compounds where reduced viscosity aids air release and substrate wetting, while maintaining acceptable dielectric strength and volume resistivity after full cure.



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