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High-purity, low-chloride bisphenol-A based liquid epoxy resin for enhanced electrical insulation performance.
Optimized viscosity profile (12,000–16,000 cP at 25 °C) enabling excellent processability in casting and impregnation applications.
Consistent epoxy equivalent weight (183–192 g/eq) ensuring reliable stoichiometric control in formulated systems.
Low volatile organic content (VOC < 0.1%) supporting compliance with stringent environmental and workplace safety requirements.
Excellent compatibility with standard amine and anhydride curing agents for broad formulation flexibility.
High-voltage electrical insulation systems, including cast coil windings and bushing encapsulants.
Transformer and reactor potting compounds requiring thermal stability and dielectric integrity.
Industrial-grade encapsulants for power electronics and semiconductor modules.
Electrical laminates and prepregs for printed circuit board (PCB) substrates demanding low ionic contamination.
Specialty adhesives for bonding ceramic-to-metal assemblies in aerospace and energy infrastructure.
| Chemical Type | Bisphenol-A epoxy resin |
| Product Form | Clear to pale yellow liquid |
| Appearance | Homogeneous, transparent liquid with minimal haze |
| Epoxy Equivalent Weight (EEW) | 183–192 g/eq |
| Viscosity (25 °C) | 12,000–16,000 cP |
| Chlorine Content (Total Cl) | ≤ 750 ppm |
| Volatiles Content | < 0.1 wt% |
| Primary Applications | Electrical insulation, potting, casting, and encapsulation |
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E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
