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Low-viscosity liquid epoxy resin enabling excellent flow, wetting, and air release in processing.
High purity with low chloride content for improved electrical insulation and corrosion resistance.
Compatible with standard amine, anhydride, and phenolic curing agents for flexible formulation design.
Consistent batch-to-batch performance supported by Dow’s stringent quality control and traceability.
Optimized for ambient or elevated temperature cure systems without requiring reactive diluents.
Electrical encapsulation and potting of transformers, sensors, and power electronics.
Structural adhesives for aerospace, automotive, and industrial bonding applications.
Composite matrix resin for filament-wound pressure vessels and pultruded profiles.
High-performance coatings for metal substrates requiring chemical and abrasion resistance.
Tooling resins for molds used in composite manufacturing and prototyping.
| Chemical Type | Bisphenol-A based liquid epoxy resin |
| Product Form | Clear to pale yellow liquid |
| Appearance | Homogeneous, transparent, low-viscosity liquid |
| Epoxy Equivalent Weight (EEW) | 185–192 g/eq |
| Viscosity at 25°C | 12–16 Pa·s (12,000–16,000 cP) |
| Chloride Content | ≤ 500 ppm |
| Volatiles Content | ≤ 0.3 wt% |
| Primary Applications | Encapsulation, adhesives, composites, coatings |
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E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
