Low-viscosity, reactive liquid epoxy resin with excellent flow and wetting characteristics.
High purity formulation with low chloride content for enhanced electrical insulation performance.
Compatible with a broad range of amine and anhydride curing agents for versatile formulation design.
Offers good adhesion to metals, composites, and cured polymer substrates.
Stable shelf life under recommended storage conditions (unopened, <25°C).
Electrical encapsulants and potting compounds for transformers, sensors, and power electronics.
High-voltage insulating varnishes and impregnating resins for motor and generator windings.
Structural adhesives requiring thermal stability and dielectric integrity.
Composite matrix resins for aerospace and industrial laminates.
Formulation base for specialty coatings demanding chemical resistance and adhesion.
| Chemical Type | Bisphenol-F based diglycidyl ether |
| Product Form | Clear to pale yellow liquid |
| Appearance | Transparent, slightly viscous liquid |
| Epoxy Equivalent Weight (EEW) | 159–165 g/eq |
| Viscosity at 25°C | 12,000–16,000 cP |
| Chloride Content | ≤ 500 ppm |
| Softening Point | Not applicable (liquid at room temperature) |
| Primary Applications | Electrical insulation, potting, impregnation, structural adhesives |
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E-mail: wangxingqiang@ericwchem.com
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