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High-performance, one-component, moisture-curing silicone adhesive with excellent adhesion to glass, metals, and plastics.
Offers outstanding resistance to temperature extremes—from –40 °C to +180 °C—maintaining flexibility and bond integrity.
Low modulus formulation provides superior stress relief in dynamic or thermally cycling assemblies.
UL 94 HB rated for flammability compliance in electronic and electrical applications.
Non-corrosive, acetoxy-cure chemistry ensures compatibility with sensitive substrates including copper and aluminum.
Sealing and bonding of LED lighting housings and lens assemblies.
Structural adhesion in automotive exterior trim and sensor enclosures.
Mounting and potting of power electronics modules requiring thermal stability.
Bonding of architectural glazing components exposed to UV and weathering.
Assembly of medical device housings requiring biocompatibility-supporting materials (ISO 10993 tested).
| Chemical Type | Acetoxy-cure silicone polymer |
| Product Form | Paste, single-component |
| Appearance | Opaque white to off-white paste |
| Primary Applications | Structural bonding, sealing, and gasketing in demanding industrial environments |
| Key Features | Low modulus, high elongation (>200%), rapid surface cure (skin-over in ~15 min at 23 °C/50% RH) |
| Benefits | Reduces assembly stress, eliminates need for primers on most substrates, supports automated dispensing |
| Storage Stability | 12 months unopened at ≤25 °C in original sealed packaging |
| Standards Compliance | UL 94 HB, RoHS 2011/65/EU, REACH SVHC compliant |
Contact With Us:
E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
