High thermal stability, maintaining integrity up to 200 °C long-term and withstanding short-term exposure to 250 °C.
Excellent electrical insulation properties, including low dielectric loss and stable permittivity across wide temperature and frequency ranges.
Good adhesion to diverse substrates such as metals, ceramics, and cured silicone elastomers without primer.
Low volatility and minimal outgassing, meeting NASA low-outgassing specifications for vacuum-sensitive applications.
Compatible with common solvents (e.g., xylene, toluene, VM&P naphtha) for easy formulation into coatings, encapsulants, and binders.
High-temperature protective coatings for aerospace engine components and exhaust systems.
Dielectric encapsulation for power electronics, including IGBT modules and EV inverter assemblies.
Binders for high-performance ceramic and refractory coatings used in industrial furnace linings.
Matrix resin in silicone-based composite materials for LED lighting housings and heat sinks.
Base resin for specialty release coatings on industrial baking belts and forming tools.
| Chemical Type | Methyl-phenyl silicone resin |
| Product Form | Solvent solution (typically in aromatic hydrocarbon solvent) |
| Appearance | Clear, colorless to pale yellow liquid |
| Primary Applications | High-temperature coatings, electrical insulation, ceramic binders, encapsulants |
| Key Features | Thermal stability, electrical insulation, adhesion, low outgassing |
| Benefits | Extended service life at elevated temperatures, reliability in harsh environments, formulation flexibility |
| Viscosity (25 °C, mPa·s) | 1,500–3,500 (as supplied) |
| Non-Volatile Content (wt%) | 55–65% |
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E-mail: wangxingqiang@ericwchem.com
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