High-performance, one-component, moisture-curing silicone adhesive/sealant with excellent adhesion to glass, aluminum, anodized metals, and many plastics without primer.
Exceptional resistance to weathering, UV radiation, ozone, and extreme temperatures (–40 °C to +150 °C continuous service).
Low modulus formulation provides superior flexibility and movement capability (±25% joint movement accommodation).
Non-corrosive to sensitive substrates including copper, brass, and electronics—ideal for precision assembly applications.
Meets ASTM C920 Type S, Grade NS, Class 25, T, M, G, O, and UL 94 HB flammability requirements.
Structural glazing and insulating glass unit (IGU) secondary sealants in architectural façades.
Bonding and sealing of solar panel frames, junction boxes, and photovoltaic module encapsulation.
Electronic assembly: potting, gasketing, and conformal coating for sensors, LED lighting housings, and control enclosures.
Aerospace interior trim bonding where low outgassing and flame retardancy are critical.
Automotive lighting assemblies, including headlamp and taillamp sealing requiring long-term optical clarity and durability.
| Chemical Type | Acetoxy-cure silicone polymer |
| Product Form | Paste, thixotropic, non-sag |
| Appearance | Translucent amber, uniform paste |
| Primary Applications | Adhesive bonding, structural sealing, electronic encapsulation |
| Key Features | Primerless adhesion, low modulus, UV stable, non-corrosive |
| Shore A Hardness (7 days, 23°C/50% RH) | 20–25 |
| Specific Gravity (25°C) | 1.02–1.06 |
| VOC Content | <10 g/L (compliant with EU Directive 2004/42/EC) |
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E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China