Guangzhou Eric Wei Chemical Co., Ltd.
Guangzhou Eric Wei Chemical Co., Ltd.

Dow DOWSIL HC 2000 Silicone Compound

Dow DOWSIL HC 2000 is a high-conductivity silicone compound from Dow’s DOWSIL thermal interface materials series—designed for efficient heat dissipation in power electronics and EV battery systems. It offers excellent thermal conductivity (2.0 W/mK), low compression force, and long-term stability under thermal cycling. Compatible with automated dispensing, it ensures reliable bond-line control and dielectric safety.
  • dow dowsil hc 2000 silicone compound_0e0d74d8
  • dow dowsil hc 2000 silicone compound_0e0d74d8

Features Of Dow DOWSIL HC 2000 Silicone Compound

  1. High thermal stability with continuous service capability up to 200 °C.

  2. Excellent electrical insulation properties across wide temperature and frequency ranges.

  3. Low compression set for reliable long-term sealing performance under dynamic stress.

  4. Good adhesion to common substrates including metals, plastics, and cured silicone elastomers.

  5. UL 94 HB rated — meets basic flammability requirements for non-structural applications.

Typical Applications Of Dow DOWSIL HC 2000 Silicone Compound

  1. Thermal interface materials in power electronics and LED lighting assemblies.

  2. Sealing and gasketing for automotive engine compartments and under-hood components.

  3. Dielectric encapsulation of sensors, transformers, and high-voltage connectors.

  4. Gap-filling material for battery module thermal management systems.

  5. Insulating potting compound for industrial control and renewable energy inverters.

Specifications Of Dow DOWSIL HC 2000 Silicone Compound

Chemical TypeHeat-curable addition-cure silicone rubber
Product FormTwo-part liquid compound (Part A + Part B)
AppearanceOpaque, viscous liquid (Part A); translucent liquid (Part B)
Primary ApplicationsThermal management, electrical insulation, sealing & gasketing
Key FeaturesThermally conductive, electrically insulating, low volatility
BenefitsReduced thermal resistance, enhanced component reliability, RoHS compliant
Curing SystemPt-catalyzed hydrosilylation (requires heat cure at ≥100 °C)
Storage Stability≥6 months at 25 °C when stored unopened in original packaging


Dow DOWSIL HC 2000 Silicone Compound – Frequently Asked Questions (FAQ)

Q1: What is the primary function of DOWSIL HC 2000 in industrial coatings and inks?

A: DOWSIL HC 2000 is a high-performance silicone-based additive designed to improve surface leveling, reduce defects such as orange peel and cratering, and enhance substrate wetting—particularly on low-energy or difficult-to-wet surfaces. It functions primarily as a flow and leveling agent without significantly affecting gloss or intercoat adhesion.


Q2: Is DOWSIL HC 2000 compatible with waterborne, solventborne, and UV-curable systems?

A: Yes, DOWSIL HC 2000 demonstrates broad compatibility across waterborne, solventborne, and UV-curable formulations. Its hydrophobic silicone structure allows for stable dispersion in many aqueous systems when properly incorporated, and it remains effective in low-VOC and high-solids applications without causing foaming or haze under typical usage conditions.


Q3: How should DOWSIL HC 2000 be incorporated into a formulation?

A: It is typically added during the let-down or post-addition stage, after pigments and other high-shear sensitive components have been dispersed. Gentle mixing is recommended to avoid excessive air entrapment. Dosage depends on formulation requirements but generally ranges from 0.1% to 2% by weight of total formulation, with optimal performance determined through application-specific testing.


Q4: Does DOWSIL HC 2000 affect recoatability or overcoating performance?

A: When used within recommended dosage levels, DOWSIL HC 2000 does not negatively impact intercoat adhesion or recoatability. Its molecular design minimizes surface segregation, helping maintain compatibility with subsequent layers—including topcoats and adhesives—without inducing delamination or poor wetting.



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