Guangzhou Eric Wei Chemical Co., Ltd.
Guangzhou Eric Wei Chemical Co., Ltd.

Dow DOWSIL HC 2000 Silicone Compound

Dow DOWSIL HC 2000 is a high-conductivity silicone compound from Dow’s DOWSIL thermal interface materials series—designed for efficient heat dissipation in power electronics and EV battery systems. It offers excellent thermal conductivity (2.0 W/mK), low compression force, and long-term stability under thermal cycling. Compatible with automated dispensing, it ensures reliable bond-line control and dielectric safety.
  • dow dowsil hc 2000 silicone compound_0e0d74d8
  • dow dowsil hc 2000 silicone compound_0e0d74d8

Features Of Dow DOWSIL HC 2000 Silicone Compound

  1. High thermal stability with continuous service capability up to 200 °C.

  2. Excellent electrical insulation properties across wide temperature and frequency ranges.

  3. Low compression set for reliable long-term sealing performance under dynamic stress.

  4. Good adhesion to common substrates including metals, plastics, and cured silicone elastomers.

  5. UL 94 HB rated — meets basic flammability requirements for non-structural applications.

Typical Applications Of Dow DOWSIL HC 2000 Silicone Compound

  1. Thermal interface materials in power electronics and LED lighting assemblies.

  2. Sealing and gasketing for automotive engine compartments and under-hood components.

  3. Dielectric encapsulation of sensors, transformers, and high-voltage connectors.

  4. Gap-filling material for battery module thermal management systems.

  5. Insulating potting compound for industrial control and renewable energy inverters.

Specifications Of Dow DOWSIL HC 2000 Silicone Compound

Chemical TypeHeat-curable addition-cure silicone rubber
Product FormTwo-part liquid compound (Part A + Part B)
AppearanceOpaque, viscous liquid (Part A); translucent liquid (Part B)
Primary ApplicationsThermal management, electrical insulation, sealing & gasketing
Key FeaturesThermally conductive, electrically insulating, low volatility
BenefitsReduced thermal resistance, enhanced component reliability, RoHS compliant
Curing SystemPt-catalyzed hydrosilylation (requires heat cure at ≥100 °C)
Storage Stability≥6 months at 25 °C when stored unopened in original packaging


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