Guangzhou Eric Wei Chemical Co., Ltd.
Guangzhou Eric Wei Chemical Co., Ltd.

Dow DOWSIL SE 4402 Silicone

Dow DOWSIL SE 4402 Silicone is a two-component, addition-cure liquid silicone rubber offering excellent flow, low viscosity, and high thermal stability. Ideal for precision molding of medical devices and electronics, it delivers outstanding biocompatibility, dimensional stability, and rapid cure at elevated temperatures. Part of Dow’s trusted DOWSIL SE series, this high-performance LSR ensures reliable replication and consistent mechanical properties across demanding industrial applications.
  • dow dowsil se 4402 silicone_a0696572
  • dow dowsil se 4402 silicone_a0696572

Features Of Dow DOWSIL SE 4402 Silicone

  1. High-performance, one-component, moisture-curing silicone elastomer offering excellent adhesion to diverse substrates including metals, plastics, and glass.

  2. Low modulus and high elongation enable superior stress relief and vibration damping in dynamic assemblies.

  3. Excellent resistance to thermal cycling, UV exposure, and weathering for long-term outdoor reliability.

  4. Low volatility and low odor formulation suitable for enclosed or sensitive electronic environments.

  5. RoHS compliant and meets UL 94 HB flammability requirements for electronics safety.

Typical Applications Of Dow DOWSIL SE 4402 Silicone

  1. Encapsulation and potting of power electronics, including inverters, converters, and EV battery control units.

  2. Structural bonding and sealing of LED lighting housings and optical modules exposed to outdoor conditions.

  3. Vibration-damping mounting of sensors, actuators, and automotive infotainment components.

  4. Gap-filling thermal interface material (TIM) for heat-sensitive electronics requiring mechanical compliance over rigid TIMs.

  5. Sealing of industrial control enclosures and renewable energy system junction boxes.

Specifications Of Dow DOWSIL SE 4402 Silicone

Chemical TypeCondensation-cure, acetoxy-functional silicone elastomer
Product FormPaste-like, thixotropic, ready-to-use compound
AppearanceOpaque white to off-white viscous paste
Primary ApplicationsEncapsulation, bonding, sealing, and vibration damping in electronics and industrial equipment
Key FeaturesMoisture-curing, low modulus, high elongation (>300%), non-corrosive cure byproducts
BenefitsStress relief under thermal expansion mismatch, no primer required on most substrates, room-temperature cure
Storage Stability12 months unopened at ≤25°C in original sealed container
Standards ComplianceRoHS 2015/863/EU, UL 94 HB, REACH SVHC-free


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