High-performance, one-component, moisture-curing silicone adhesive with excellent adhesion to diverse substrates including metals, plastics, and glass.
Offers outstanding thermal stability across a wide service temperature range of –55 °C to +200 °C.
Provides superior resistance to weathering, UV exposure, ozone, and humidity without significant property degradation.
Low modulus formulation delivers high flexibility and stress relief for bonded assemblies subjected to thermal cycling or vibration.
Meets UL 94 HB flammability rating and complies with RoHS Directive 2011/65/EU for restricted substances.
Bonding and sealing of electronic enclosures, power supplies, and LED lighting housings.
Structural assembly of automotive sensors, control modules, and under-hood components.
Permanent bonding of glass-to-metal and plastic-to-metal interfaces in architectural and transportation glazing systems.
Sealing and mounting of HVAC components, solar panel frames, and industrial instrumentation housings.
| Chemical Type | Acetoxy-cure silicone elastomer |
| Product Form | Paste, thixotropic, single-component |
| Appearance | Opaque white to off-white |
| Primary Applications | Bonding, sealing, and gasketing in electronics, automotive, and industrial equipment |
| Key Features | Room-temperature vulcanization (RTV), low modulus, excellent adhesion without primer |
| Benefits | Reduced assembly time, long-term reliability under thermal cycling, no solvent emission |
| Cure Mechanism | Moisture-cured (acetic acid byproduct) |
| Shelf Life (unopened) | 12 months at ≤25 °C in original sealed container |
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E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China