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Ultra-low ionic residue (<1.0 µg/cm² Na⁺, Cl⁻, SO₄²⁻) to prevent electrochemical migration in high-reliability microelectronics.
Non-corrosive to gold, copper, aluminum, and solder mask—validated per IPC-J-STD-004B and MIL-STD-883H Method 2019.
Zero halogen content (Cl <5 ppm, Br <5 ppm), compliant with IPC-4552A for ENIG/ENEPIG surface finish cleaning.
Rapid evaporation at room temperature with no rinse required—enabling dry-in-place processing for inline automation.
Batch-to-batch consistency certified via ICP-MS trace metal analysis (Au, Pd, Ni, Fe <10 ppt).
Cleaning of wire-bondable gold pads prior to Au-Al thermosonic bonding in RF and MEMS packaging.
Pre-assembly decontamination of gold-plated contacts, connectors, and RF shielding components.
Removal of organic residues (fluxes, fingerprint oils, handling contaminants) from Au-coated sensor electrodes and probe cards.
Final surface conditioning of gold metallization on high-frequency PCBs before conformal coating or underfill dispensing.
Post-plating cleaning of electroless nickel immersion gold (ENIG) and electroless palladium immersion gold (EPIG) finishes.
| Chemical Type | Proprietary non-ionic surfactant blend in ultra-pure deionized water (18.2 MΩ·cm resistivity) |
| Product Form | Clear, colorless aqueous solution |
| Appearance | Transparent, particle-free liquid (0.2 µm filtered) |
| pH (25°C) | 6.8–7.2 |
| Primary Applications | Gold surface preparation for bonding, plating, and assembly in semiconductor, aerospace, and medical electronics |
| Key Features | Halogen-free, non-volatile residue (NVR) <0.5 µg/cm²; TOC <50 ppb |
| Benefits | Eliminates post-clean drying steps; compatible with automated spray, dip, and ultrasonic systems |
| Regulatory Compliance | RoHS 2015/863, REACH SVHC-free, IPC-CC-830B qualified, ISO 9001 & ISO 14001 certified manufacturing |
| Common Compatible Systems | Suitability |
| Ultrasonic Cleaning Systems (40–80 kHz) | Highly Recommended – Optimized for 25–45°C operation; no cavitation damage to fine-pitch gold features |
| In-line Spray Washers (e.g., Modutek, Aqueous) | Highly Recommended – Fully compatible with stainless-steel and PVDF fluid paths; no foaming or nozzle clogging |
| Benchtop Immersion Baths (PP or quartz) | Recommended – Requires bath temperature control (20–30°C); stable for ≥72 hours under nitrogen blanket |
| DI Water Rinse Stations | Suitable – Optional final rinse improves particulate removal; not required for residue compliance |
Q1: What is the CAS Registry Number for this product?
A: This is a proprietary multi-component formulation; individual CAS numbers are not assigned. Full compositional disclosure is available under NDA to qualified customers per TSCA §8(b) reporting requirements.
Q2: What is the recommended usage concentration and dwell time?
A: Use undiluted. Typical dwell time is 30–90 seconds at ambient temperature (20–25°C); extended immersion (>5 min) is not recommended to avoid potential surfactant film retention.
Q3: How does it compare to IPA or acetone for gold surface cleaning?
A: Unlike IPA or acetone—which leave static charge, lack ionic residue control, and pose flammability risks—this cleaner provides electrostatically neutral, residue-controlled cleaning validated for Class 100 cleanroom use and JEDEC JESD22-A121B compatibility.
Q4: Is it certified for aerospace or medical device manufacturing?
A: Yes—qualified per NASA-STD-6002 Rev C (cleanliness verification), ASTM F2476 (biocompatibility screening), and supported by full lot traceability, CoA, and extractables data per USP <661.2>.
Q5: Does it cause gold migration or interfacial delamination during thermal cycling?
A: No—validated through 1000-cycle JEDEC JESD22-A104D thermal shock (-65°C to +150°C) and 85/85 reliability testing; zero observed gold diffusion or adhesion loss per SEM/EDS cross-section analysis.
Contact With Us:
E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
