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Non-corrosive formulation designed to safeguard etching bank hardware without compromising metal integrity.
Thermally stable up to 120°C, ensuring consistent performance during high-temperature etch processes.
Low-volatility solvent system minimizes workplace exposure and reduces VOC emissions.
Fast-drying film-forming action provides immediate barrier protection against acidic and halogenated etchants.
pH-neutral (6.8–7.2) to prevent galvanic corrosion on mixed-metal etching fixtures.
Protection of stainless steel and titanium etching racks in semiconductor wafer processing lines.
Shielding aluminum and copper busbars in printed circuit board (PCB) wet etching tanks.
Preventing undercutting and pitting on nickel-plated anode frames used in electrochemical etching systems.
Surface passivation of polymer-coated fixturing in microelectromechanical systems (MEMS) batch etchers.
Temporary masking of non-etch zones on precision-machined ceramic and quartz etch chucks.
| Chemical Type | Water-dispersible, siloxane-modified acrylic copolymer |
| Product Form | Clear, low-viscosity liquid (ready-to-use) |
| Appearance | Transparent, slightly opalescent solution |
| Primary Applications | Protective coating for etching fixtures, racks, and chucks |
| Key Features | Film thickness: 5–12 µm per coat; peelable after etch cycle |
| Benefits | Reduces fixture replacement frequency by ≥40%; extends tank maintenance intervals |
| Regulatory Compliance | REACH SVHC-free; RoHS 3 compliant; OSHA HCS-aligned SDS available |
| Storage Stability | 24 months unopened at 5–30°C; shake well before use |
| Common Compatible Systems | Suitability |
| Wet Bench Etch Stations (e.g., Modutek, SemiQ) | Highly Recommended – Validated for use with HF/HNO₃, FeCl₃, and CuCl₂ chemistries |
| Automated Spray Etch Cabinets (e.g., Technics, Suss MicroTec) | Recommended – Requires pre-dry cycle optimization; no residue under standard rinse protocols |
| Batch Immersion Tanks with PTFE-coated liners | Suitable – Non-reactive with fluoropolymer surfaces; no adhesion loss after 10+ cycles |
| Ultrasonic-Assisted Etch Systems | Recommended – Stable film integrity observed at 40 kHz; no premature delamination |
Q1: What is the CAS Registry Number for Etching Bank Protectant?
A: The CAS number is 2089254-87-1. This identifier applies to the proprietary polymer blend as supplied; individual monomers are listed separately in the full SDS.
Q2: What is the recommended application method and coverage rate?
A: Apply via immersion dip, airless spray, or soft brush. Typical coverage: 8–10 m²/L per single 8-µm coat. Two thin coats are preferred over one thick coat for uniform film integrity.
Q3: How does it compare to traditional wax-based protectants in terms of removal and residue?
A: Unlike solvent-intensive waxes, Etching Bank Protectant removes completely with deionized water rinse (≥15 PSI) or mild alkaline cleaner (pH 9–10), leaving zero extractable residue—validated by IC-MS analysis per SEMI F57.
Q4: Is migration or leaching into etchant baths a concern during operation?
A: No measurable migration occurs under standard operating conditions (≤60°C, ≤30 min dwell). Independent testing shows <0.02 ppm total organic carbon (TOC) contribution to bath after 5 consecutive cycles.
Q5: Does it meet FDA or USP Class VI requirements for cleanroom tooling?
A: While not certified for direct food or pharmaceutical contact, it meets ISO 14644-1 Class 5 particulate limits post-application and has passed USP <87> cytotoxicity screening for tooling materials used in controlled environments.
Contact With Us:
E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
