High-performance bisphenol-A based liquid epoxy resin with excellent mechanical strength and chemical resistance.
Low viscosity (12,000–14,000 cP at 25°C) enabling easy handling, mixing, and impregnation of fiber reinforcements.
Superior adhesion to metals, composites, and cured thermosets—ideal for structural bonding and coating applications.
Good thermal stability with glass transition temperature (Tg) up to 130°C after full curing with standard amine hardeners.
Low volatility and low halogen content, supporting compliance with RoHS and REACH regulatory requirements.
Aerospace composite matrix resin for prepregs and filament-wound components.
Electrical insulation systems in high-voltage transformers and bushings.
Structural adhesive formulations for automotive lightweight assemblies.
Protective coatings for offshore and industrial steel infrastructure.
Encapsulants and potting compounds for power electronics and LED modules.
| Chemical Type | Bisphenol-A diglycidyl ether (DGEBA) |
| Product Form | Clear, low-viscosity liquid |
| Appearance | Water-white to pale yellow, transparent |
| Epoxy Equivalent Weight (EEW) | 185–192 g/eq |
| Viscosity (25°C) | 12,000–14,000 cP |
| Chloride Content | ≤ 500 ppm |
| Density (25°C) | 1.16–1.18 g/cm³ |
| Storage Stability | ≥ 12 months at ≤ 25°C in sealed containers |
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E-mail: wangxingqiang@ericwchem.com
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