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Low-viscosity, liquid aliphatic amine curing agent enabling excellent processability and easy metering.
Provides rapid room-temperature cure with good mechanical properties and chemical resistance.
Offers low exotherm during polymerization—ideal for thick-section casting and heat-sensitive substrates.
Compatible with standard bisphenol-A and bisphenol-F epoxy resins without need for solvents or modifiers.
Meets stringent VOC regulations with negligible volatile organic compound content.
Electrical encapsulation and potting compounds for transformers, sensors, and power electronics.
High-performance industrial flooring and heavy-duty protective coatings.
Adhesives and structural bonding systems in transportation and wind energy components.
Composite matrix resins for pultrusion and filament winding of fiberglass and carbon fiber parts.
Repair mortars and grouts requiring fast turnaround and high early strength development.
| Chemical Type | Aliphatic polyamine |
| Product Form | Liquid |
| Appearance | Clear, pale yellow to amber liquid |
| Primary Applications | Room-temperature and elevated-temperature epoxy curing |
| Key Features | Low viscosity, fast cure, low exotherm, solvent-free |
| Benefits | Improved work life control, reduced shrinkage, enhanced adhesion to metals and composites |
| Density (20 °C) | ~0.92–0.94 g/cm³ |
| Amine Value | ~380–420 mg KOH/g |
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E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
