High reactivity with standard epoxy resins, enabling fast gelation and reduced cycle times.
Excellent compatibility with bisphenol-A and bisphenol-F epoxy systems.
Low viscosity for easy handling, precise metering, and homogeneous mixing without solvents.
Good thermal stability and low volatility, supporting safe processing in industrial environments.
Enables high glass transition temperature (Tg) and superior mechanical performance in cured networks.
Structural adhesives for automotive and aerospace bonding.
Electrical encapsulation and potting compounds for power electronics.
High-performance composites in wind turbine blade manufacturing.
Coatings for corrosion protection in oil & gas infrastructure.
Tooling and casting resins requiring rapid turnaround and dimensional stability.
| Chemical Type | Amine-based aliphatic curing agent |
| Product Form | Liquid |
| Appearance | Pale yellow to colorless clear liquid |
| Density (20 °C) | Approx. 0.92–0.95 g/cm³ |
| Viscosity (25 °C) | Approx. 180–220 mPa·s |
| Amine Value | 360–390 mg KOH/g |
| Reactive Hydrogen Equivalent Weight | Approx. 85–92 g/eq |
| Storage Stability | At least 12 months at 25 °C in original sealed container |
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E-mail: wangxingqiang@ericwchem.com
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