Fast-reacting aliphatic amine-based curing agent enabling rapid room-temperature cure of epoxy resins.
Excellent compatibility with standard bisphenol-A and bisphenol-F epoxy resins.
Low viscosity for easy metering, mixing, and improved wetting of fillers and reinforcements.
Good chemical resistance in cured systems, particularly against alkalis and solvents.
Low volatility and reduced amine odor compared to conventional aliphatic amines.
Structural adhesives for metal, composite, and concrete bonding.
Electrical encapsulants and potting compounds requiring fast turnaround.
Repair mortars and high-strength grouts for civil engineering applications.
Coating systems for industrial flooring and corrosion protection.
Wind turbine blade adhesive bonding and composite tooling resins.
| Chemical Type | Aliphatic polyamine adduct |
| Product Form | Liquid |
| Appearance | Pale yellow to amber clear liquid |
| Viscosity (25°C) | 200–400 cP |
| Amine Value | 380–420 mg KOH/g |
| Density (25°C) | 0.92–0.96 g/cm³ |
| Reactivity Profile | Room-temperature curable; gel time ~30–60 min (with DGEBA at 100 phr) |
| Primary Applications | Adhesives, coatings, composites, and repair mortars |
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E-mail: wangxingqiang@ericwchem.com
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