Guangzhou Eric Wei Chemical Co., Ltd.
Guangzhou Eric Wei Chemical Co., Ltd.

Henkel AQUENCE XP221 Hot Melt Adhesive

Henkel AQUENCE XP221 is a high-performance hot melt adhesive in the AQUENCE series, engineered for demanding automotive and industrial bonding applications. It delivers excellent heat resistance, fast set time, and strong adhesion to plastics, metals, and composites. Designed for automated dispensing, it offers consistent viscosity, low odor, and RoHS compliance—ideal for structural and semi-structural assembly where reliability and process efficiency are critical.
  • henkel aquence xp221 hot melt adhesive_41bea73f
  • henkel aquence xp221 hot melt adhesive_41bea73f

Features Of Henkel AQUENCE XP221 Hot Melt Adhesive

  1. Fast-setting formulation enabling high-speed production line integration.

  2. Excellent thermal stability for consistent performance in demanding hot melt equipment.

  3. Strong initial tack and long-term bond durability on low-surface-energy substrates.

  4. Low odor and low volatile organic compound (VOC) emissions, supporting safer workplace environments.

  5. Optimized rheology for precise bead control and minimal stringing during application.

Typical Applications Of Henkel AQUENCE XP221 Hot Melt Adhesive

  1. Nonwoven lamination in hygiene products (e.g., diapers, feminine care).

  2. Filter media bonding for HVAC and automotive cabin air filters.

  3. Medical packaging assembly, including breathable barrier laminates.

  4. Flexible packaging seam sealing for pouches and sachets.

  5. Label stock construction with polypropylene and PET facestocks.

Specifications Of Henkel AQUENCE XP221 Hot Melt Adhesive

Chemical TypeStyrene-isoprene-styrene (SIS) block copolymer-based
Product FormPellets
AppearanceLight amber, uniform cylindrical pellets
Softening Point (Ring & Ball)85–90 °C
Melt Viscosity (at 160 °C)3,500–4,500 mPa·s
Application Temperature Range150–170 °C
Primary ApplicationsNonwovens, filtration, medical packaging, flexible packaging
Key FeaturesHigh-speed compatibility, low-stringing, substrate versatility


Get in Touch with ERICW
Let competitive chemical materials go global.

Your Name *

Your Email *

Your Phone

Country

Your Message *