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High-purity, low-viscosity liquid bisphenol-A epoxy resin for excellent processability and ease of handling.
Consistent molecular weight distribution ensuring reproducible performance in formulation and curing.
Excellent compatibility with a wide range of amine, anhydride, and phenolic hardeners.
Superior electrical insulation properties with high dielectric strength and volume resistivity.
Good adhesion to metals, composites, and cured polymer substrates across diverse service conditions.
Electrical encapsulation and potting compounds for transformers, sensors, and power electronics.
Structural adhesives requiring high bond strength and thermal stability.
Composite matrix resins for aerospace and wind energy components.
Coating systems for corrosion protection of steel infrastructure and marine equipment.
High-performance casting and laminating resins in industrial tooling and mold making.
| Chemical Type | Bisphenol-A based liquid epoxy resin |
| Product Form | Clear to pale yellow liquid |
| Appearance | Transparent, slightly viscous liquid at 25°C |
| Epoxy Equivalent Weight (EEW) | 185–192 g/eq |
| Viscosity (25°C) | 12,000–16,000 cP |
| Chlorine Content | < 1,000 ppm |
| Softening Point | Not applicable (liquid at room temperature) |
| Key Features | Low volatility, low halogen content, high purity, excellent hydrolytic stability |
Contact With Us:
E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
