Low-viscosity liquid epoxy resin ideal for easy handling and processing.
Excellent compatibility with common amine and anhydride curing agents.
Provides high mechanical strength and dimensional stability in cured systems.
Good adhesion to metals, composites, and various substrates.
Offers balanced reactivity for controlled gel time and extended working life.
Aerospace composite matrices for structural and semi-structural components.
High-performance industrial coatings requiring chemical resistance and durability.
Electrical encapsulation and potting compounds for electronics protection.
Adhesives and bonding systems in demanding transportation and energy applications.
Tooling resins for molds and master patterns in composite manufacturing.
| Chemical Type | Diglycidyl ether of bisphenol-A (DGEBA) |
| Product Form | Clear, low-viscosity liquid |
| Appearance | Colorless to pale yellow, transparent |
| Epoxy Equivalent Weight (EEW) | 185–192 g/eq |
| Viscosity at 25°C | 12–16 Pa·s (12,000–16,000 cP) |
| Chloride Content | ≤ 0.1 wt% |
| Softening Point | Not applicable (liquid at room temperature) |
| Key Features | Low viscosity, high purity, consistent batch-to-batch performance |
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E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China