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Low-viscosity liquid epoxy resin ideal for easy handling and processing.
Excellent compatibility with common amine and anhydride curing agents.
Provides high mechanical strength and dimensional stability in cured systems.
Good adhesion to metals, composites, and various substrates.
Offers balanced reactivity for controlled gel time and extended working life.
Aerospace composite matrices for structural and semi-structural components.
High-performance industrial coatings requiring chemical resistance and durability.
Electrical encapsulation and potting compounds for electronics protection.
Adhesives and bonding systems in demanding transportation and energy applications.
Tooling resins for molds and master patterns in composite manufacturing.
| Chemical Type | Diglycidyl ether of bisphenol-A (DGEBA) |
| Product Form | Clear, low-viscosity liquid |
| Appearance | Colorless to pale yellow, transparent |
| Epoxy Equivalent Weight (EEW) | 185–192 g/eq |
| Viscosity at 25°C | 12–16 Pa·s (12,000–16,000 cP) |
| Chloride Content | ≤ 0.1 wt% |
| Softening Point | Not applicable (liquid at room temperature) |
| Key Features | Low viscosity, high purity, consistent batch-to-batch performance |
Q1: What is the primary function of HELoxy 107 in epoxy formulations?
A: HELoxy 107 is a reactive diluent designed to reduce viscosity and improve processability of standard bisphenol-A epoxy resins without significantly compromising final crosslink density or thermal performance.
Q2: Is HELoxy 107 compatible with common amine and anhydride curing agents?
A: Yes, HELoxy 107 is broadly compatible with aliphatic and aromatic amines, as well as cyclic anhydrides, and participates in the cure reaction due to its epoxide functionality.
Q3: How does HELoxy 107 compare to non-reactive diluents in terms of VOC and film properties?
A: As a reactive diluent, HELoxy 107 becomes part of the polymer network upon curing—eliminating VOC emissions associated with solvent-based systems and helping retain mechanical integrity, adhesion, and chemical resistance in the final coating or composite.
Q4: Can HELoxy 107 be used in high-performance composites or electrical encapsulation applications?
A: Yes, it is commonly employed in composite matrices and electrical potting formulations where low viscosity, good wetting of reinforcements or substrates, and retention of dielectric properties after cure are required.
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